年度 2019
全部作者 王莅君、Shu-Feng Cheng、Po-Tsang Huang、Li-Chun Wang、Mau-Chung Frank Chang
论文名称 Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration
期刊名称 IEEE Design & Test, Vol. 36, No. 6, pp. 63-71, Dec. 2019
语言 英文